Electronics for automobiles sit in the middle of two key trends in the semiconductor industry. The first is the increasing need for functional safety in many applications, bolstered both by user demands and formal standards. Safety considerations affect many aspects of chip development, from technology choices to system implementation. The other key trend is the move toward multi-die designs where homogeneous dies (also called chiplets) or heterogeneous dies implemented in different process technologies are integrated in a single package using standard or advanced package technologies. Yield considerations, ability to mix and match dies, optimizing power, performance, and area (PPA), and other factors are making multi-die design more attractive. This white paper examines the intersection of the two trends, as multi-die design is becoming an inevitable choice for automotive applications. This approach offers several advantages but is not without its challenges, and some of these are also discussed.

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