Verified
来源、主体与时间与首次落库记录一致。
| 文章 | The current state of Hybrid Bonding in 2026 — TSMC sits at 6 microns and the HBM delay that nobody expected |
| 信任等级 | Aggregate |
| 发布主体 | — |
| 来源 | https://www.tomshardware.com/tech-industry/semiconductors/hybrid-bonding-roadmap-examined |
| 创建时间 | Wednesday, 2 September 2026 - 23:32 |
| 已记录哈希 | 3dd15250c3942e01e3573fef5f64e38d1bf362eee973a1dbb02b94f175ace9ee |
| 重算哈希 | 3dd15250c3942e01e3573fef5f64e38d1bf362eee973a1dbb02b94f175ace9ee |
哈希算法：sha256(来源URL|主体ID|创建时间戳)，主体缺失时主体ID为 0。