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Aggregate EE Times 芯片半导体 28 Aug 2026 - 06:30

First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC

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关键摘要

At a pre-Hot Chips media briefing this week, OpenAI’s VP of hardware, Richard Ho, revealed results of first benchmarks for its clean‑sheet ASIC designed specifically for large language models (LLMs).

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正文提要

At a pre-Hot Chips media briefing this week, OpenAI’s VP of hardware, Richard Ho, revealed results of first benchmarks for its clean‑sheet ASIC designed specifically for large language models (LLMs).

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