{"node":{"id":17455,"uuid":"5e9e071e-7063-4341-b9d6-13b32e645052","title":"Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory \u2014 zHBM ultimately stacks DRAM directly on top of the processor","url":"https:\/\/www.xmt.pub\/node\/17455","created":1788262329},"trust_level":"l0_aggregate","publisher":null,"source_url":"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/hot-chips-2026-samsung-reveals-a-three-phase-hbm-roadmap-that-puts-logic-and-compute-inside-memory-zhbm-ultimately-stacks-dram-directly-on-top-of-the-processor","provenance":{"algorithm":"sha256(source_url|publisher_id|created)","stored":"8eff060be0a4f8100fe0567ab2598da156949be11918a9e65cfdc00a2f718d8a","expected":"8eff060be0a4f8100fe0567ab2598da156949be11918a9e65cfdc00a2f718d8a","status":"verified"}}