Verified
来源、主体与时间与首次落库记录一致。
| 文章 | Hot Chips 2026: Samsung reveals a three-phase HBM roadmap that puts logic and compute inside memory — zHBM ultimately stacks DRAM directly on top of the processor |
| 信任等级 | Aggregate |
| 发布主体 | — |
| 来源 | https://www.tomshardware.com/tech-industry/semiconductors/hot-chips-2026-samsung-reveals-a-three-phase-hbm-roadmap-that-puts-logic-and-compute-inside-memory-zhbm-ultimately-stacks-dram-directly-on-top-of-the-processor |
| 创建时间 | Tuesday, 1 September 2026 - 19:32 |
| 已记录哈希 | 8eff060be0a4f8100fe0567ab2598da156949be11918a9e65cfdc00a2f718d8a |
| 重算哈希 | 8eff060be0a4f8100fe0567ab2598da156949be11918a9e65cfdc00a2f718d8a |
哈希算法：sha256(来源URL|主体ID|创建时间戳)，主体缺失时主体ID为 0。